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Odersun
AG has broken ground on its second flexible substrate
Copper-Indium-diSulphide on copper tape (CISCut) manufacturing plant in
Fürstenwalde, Germany.
The €50 million project will house two separated facilities, one for the cell production and one for the module fabrication. The cell facility will include 6 separate production lines with a 30MW capacity, with first phase ramp expected in the 4th quarter of 2008.
“We continue our step by step growth strategy to manage risk and to build larger capacities as soon as possible” says Ramin Lavae Mokhtari, CEO of Odersun AG. Odersun AG’s growth is backed-up by a €61 million ($90 million) funding, including a € 40 million series B financing round with international investors and another €21 million in grants.
