Dow Corning partners with IMEC on ultra-thin solar wafer encapsulation

Intended to bring a range of new products to market for future advanced c-Si solar cell production and module assembly, Dow Corning has joined several of IMEC’s industrial affiliation program (IIAP) on silicon solar cells. The collaboration includes development of novel silicone encapsulant processes for integrated cell and module processing using new cell structures that could be required when using ultra-thin and large wafers.

“With Dow Corning joining our silicon solar cell IIAP, our research can benefit from the latest innovations in materials,” noted Jef Poortmans, Program Director IMEC Energy. “By bringing together all the different players in the silicon solar cell value chain, ranging from energy companies, solar cell manufacturers to material and equipment suppliers, we can speed up the development of new processes which are tested on a semi-industrial pilot line. As such we accelerate the transfer to mass production.”

Eric Peeters, Vice President, Dow Corning Solar Business said,  “It is all about commercializing new technologies that will make solar panels more efficient and more durable, leading to a significant reduction of the cost per kWh of energy generated with photovoltaics. Dow Corning strongly believes in IMEC’s approach to bring world leaders across the value chain together to work synergistically and make step-change innovation a reality.”

Dow Corning signed a three-year contract with IMEC to undertake joint research on advanced cell technology.

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