EU PVSEC: Meyer Burger offering suite of technologies to join the 300W club

  •   The 303W module uses 60 Cz-Si pseudo square 156mm x 156mm wafers with heterojunction cells that the company claims provides a roadmap to up to 24% conversion efficiencies as well as a reduction in manufacturing costs for cells to under 0.10$/Wp by 2014.
    The 303W module uses 60 Cz-Si pseudo square 156mm x 156mm wafers with heterojunction cells that the company claims provides a roadmap to up to 24% conversion efficiencies as well as a reduction in manufacturing costs for cells to under 0.10$/Wp by 2014.

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Based on a standard 60-cell solar module, rather than a recent wave of larger-sized modules using many more cells to push module wattage output above 300 watts, Meyer Burger will be showcasing a 303W module at EU PVSEC that has been verified by the SGS Fresenius IEC Institute.

Meyer Burger is using its membership of the 300W club to highlight its suite of innovative technologies across its broad product offering that when carefully combined can produce significantly higher yielding modules.

Central to the improvements was the use of its heterojunction cells with < 21% efficiency and a very low temperature coefficient and with it’s newly developed ‘SmartWire Connection’ technology.

Heterojunction cells are claimed to offer good temperature coefficient with a value of just -0.18%/°C, compared to standard cells which have a value of -0.43%/°C, supporting claims of 10% more energy yield.

The 303W module uses 60 Cz-Si pseudo square 156mm x 156mm wafers with heterojunction cells that the company claims provides a roadmap to up to 24% conversion efficiencies as well as a reduction in manufacturing costs for cells to under 0.10$/Wp by 2014.

Meyer Burger claims that further cost reductions can be expected through the use of thinner wafers which heterojunction technology, in comparison to conventional technologies, can process without any loss of efficiency. Meyer Burger’s diamond wire saws is claimed to enable thin wafers while achieving savings in kerf loss and other material savings.

The 303W module employs a 5 busbar connection technology with a soldering process for cell strings carried out within the laminator. Meyer Burger claims that its ‘SmartWire Connection’ technology, offers lower series resistance, boosting performance by more than 1% absolute or by 7% relative, while significantly lowering silver usage. 

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