Printed electronics segment has potential to hit US$9.4 billion in 2012, says IDTechEx

  • Konarka's printed flexible plastic solar film.
    Konarka's printed flexible plastic solar film.
  •   Printed and potentially printed electronics market size by component type in 2012. Image: IDTechEx
    Printed and potentially printed electronics market size by component type in 2012. Image: IDTechEx

According to a report released by research and consultancy group IDTechEx, the market for printed electronics has the potential to reach around US$9.4 billion by the end of the year. This figure includes devices that are not currently printed but which are moving towards being printed, of which 30% of the devices under inclusion are made predominately by printing, and 6% are manufactured on a non-rigid substrate.

The four chief markets that make up this proposed figure of US9.4 billion are as follows:

  • OLED displays, thanks to ever-evolving smart phones. This segment will account for around US$4 billion of the projected 2012 figure.
  • CIGS-based PV will increase to US$2.6 billion, the vast majority of which will be non-printed and on glass.
  • Conductive inks used (mainly) in PV cell busbars will bring in US$2.3 billion in 2012. Almost all of this is flake-based ink.
  • Around US$290 million will be spent on e-paper material (excluding the value of the TFT backplane) for e-readers.

Furthermore, IDTechEx believes that the OLED display market could rise as high as US$30 billion by 2022, of which 20% will be printed and 17% on a non-rigid substrate. By 2022, the company expects the printed electronics market as a whole to reach US$63 billion, of which 45% will be printed and 33% on a non-rigid substrate.
 
Further information on the report and an in-depth 10-year forecast by sector is available here.

Newsletter

Preview Latest
Subscribe
We won't share your details - promise!

Publications

  • Photovoltaics International 19th Edition

    For manufacturers who had their heads in the bunker during 2012, fighting falling ASPs and eroding margins, the nineteenth edition brings you details of what lies in store for this coming year. Wright Williams & Kelly return in this issue with their popular analysis of payback on technology buys; crucially they analyze n-type wafers, Al2O3 passivation and copper metallization. SERIS shows us how to achieve 18.7% efficiencies using low-cost etching techniques on diffused wafers. We also have two important technology roundups: CIGS from Helmholtz Berlin, and PV module encapsulation techniques from Fraunhofer ISE.

  • Manufacturing The Solar Future: The 2013 Production Annual

    In the ever-changing global solar markets, cost reduction and measures to increase cell efficiencies are the key tools available to PV manufacturers to create new opportunities and drive your business to the next level. Manufacturing the Solar Future 2013 is the third in the Photovoltaics International PV Production Annual series, delivering the next instalment of in-depth technical manufacturing information on PV production processes designed to help you gain the competitive edge.

Partners

Acknowledgements

Solar Media