Meyer Burger is offering the DW 288+ as the first diamond wire saw system designed specifically for monocrystalline solar wafer applications. The DW 288 platform enables the slicing of silicon bricks into ultrathin wafers.
The Heraeus Photovoltaics Business Unit has launched two new high efficiency front-side metallization pastes for standard to ultra-lightly doped emitter cells – the SOL9620 Series and SOL9621 Series.
Applied Materials has entered the solar wafer inspection market with ‘Applied Vericell’ system designed to fully-automate in-line wafer inspection to address the quality limitations of manual review, with the capability to automatically predict wafer cell efficiency through photoluminescence (PL) technology. The Vericell system is being introduced at SNEC 2014 in Shanghai, China.
Isovoltaic’s recently introduced PV module backsheet combines both ‘Tedlar’ and ‘Polyamide’ materials to provide improved characteristics for field durability and module efficiency increase, especially in challenging conditions.
Dow Corning’s silicone-based, next-generation Electrically Conductive Adhesive (ECA) ‘PV-5802’ will be used in Tianwei New Energy’s Metal Wrap Through (MWT) module production line, developed by ECN of the Netherlands. PV-5802 is said to provide improved electrical properties and stability, which will greatly enhance the electrical performance, reliability and durability of MWT modules.
GCL-Poly Energy Holdings has started commercial mass production for its second-generation quasi-monocrystalline silicon wafer product. The GCL ‘Monocrystalline G2’ wafer is claimed to be comparable in conversion efficiencies with that of conventional Czochralski-based monocrystalline wafers.
FLEXcon has expanded its solar module backsheet ‘multiGUARD’ offering with the addition of Black/White and Black/Black products. The new, more aesthetically pleasing black backsheet products appeal to the high-end commercial market and a much greater portion of the residential market.
US start-up, Scifiniti is developing a low-cost ‘SmartWafer’ that is claimed to enhance the performance and significantly lower the cost of silicon-based products.
Meyer Burger and LayTec have collaborated to produce the world’s first fully integrated EVA cross-linking metrology solution for PV module production lines.
Designed for solar modules with cells for rear-side contacting, ‘AKACON BCF’ PV backsheet is being offered by the KREMPEL Group and is ready for volume production. The backsheet comes with a copper layer and is structured according to customer’s design for back-contact cells.