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Manz has made significant updates to its SpeedPicker series system for high-volume crystalline solar cell manufacturing applications. According to Manz, its first generation system had sales of over 300 units. Introduced at the EU PVSEC in Hamburg in September, 2011 the SpeedPicker 1.1 has a throughput rate of 5,000 wafers per hour and one of the world’s best breakage rates compared to competitors’ products.
IMA Automation Berlin has significantly enhanced and upgraded its ‘modustringer’ series. The new modustringer has been reduced in length by one third and offered at lower-price points compared to the orginal system introduced 2-years ago. According to IMA Automation the new system features a simplified process flow and increased service friendliness. The modustringer series realizes a single-track throughput of 1,200 cells per hour. The glue-dispenser option aims for future solutions in the fully automated stringing of Si-PV modules.
Singulus Technologies has launched an enhanced wet-chemical processing system for thin film solar module manufacturing dubbed the ‘VITRUM’ GEN 2. Singulus claims the upgraded system offers substantial cost-saving potential and can easily be integrated into already existing manufacturing lines.
Ferro Electronic Materials is introducing a new optimized paste system to enhance performance of p-type Metal Wrap Through (MWT) cells at the 26th European Photovoltaic Solar Energy Conference and Exhibition (EU PVSEC), in Hamburg, Germany. The materials include a next-generation rear silver plug hole paste, high efficiency front silver contact pastes, and a back contact aluminum paste.
Zimmermann & Schilp’s non-contact PV wafer handling systems use an ultrasound air bearing for completely new ways of handling c-Si wafers. The PV technology roadmap dictates that thinner PV wafers will be necessary to aid in material cost reduction, along with equipment performance improvements and higher efficiencies.
Trident Solar has initiated the global launch of its new single-step ‘VersaEtch’ Etchant / n-Dopant material for inkjet selective emitter application of solar front contacts (c-Si) at EU PVSEC. Used with the Trident 256Jet-S printhead, the new VersaEtch Etchant/n-Dopant is claimed to match the enhanced cell efficiency (0.5-1.0%) and precise deposition performance (demonstrated 50 micron print) of other selective emitter approaches, while offering the additional benefits of being non-contact, single-step, and cost-effective. Ink jet doping and etching with VersaEtch is said to be a hybrid tool that can be used together with either screen printing or electroplating of metallized contacts.
Aurora Control Technologies has launched ‘Decima CI,’ a new in-line emitter dopant measurement system, that is claimed to be the industry’s first in-line, non-contact emitter dopant measurement system featuring whole-wafer mapping at full production throughput for 100% of manufactured cells. The Decima CI is the first in a family of products to be launched by Aurora that provide for continuous cost-effective measurement of the critical-to-quality wafer parameters in today’s high-volume photovoltaic cell manufacturing processes.
Merck has developed an alternative structuring technology with its etching pastes and is offering patterning concepts under the ‘isishape’ product portfolio. isishape ‘SolarEtch’ was used in the first industrial selective emitter production and became a proven structuring method in various production lines of leading solar cell manufacturers. These material concepts are able to be used to optimized new cell designs that seek to provide higher cell efficiencies at a competitive cost structure.
Singulus Technologies has made significant improvements to its TENUIS platform for wet-chemical coating of thin-film solar modules made of copper-indium-gallium-diselenide (CIGS) on glass. The TENUIS GEN 2 system incorporates new and unique concepts in terms of dosing and temperature control, while reducing the process time by up to 20%. The floor-space requirements of the modular system have also been reduced by 30%.
Henkel has introduced ‘Loctite 3382’ in an effort to simplify silicon ingot bonding and protect against wafer breakages. Loctite 3382 provides improved bonding strength of the ingot in the sawing process and is de-bondable in hot water. This new bonding solution helps to avoid corrosion of the equipment and is free of caustic odor.
