Spire Corporation has introduced a new advanced metrology platform: the ‘Spi-EL’ Electroluminescence Solar Module Tester, at the SNEC exhibition in Shanghai, China. The Spi-EL-HR (high resolution) and Spi-EL-MR (medium-resolution), can be used for pre- and post-lamination of framed or unframed modules.
Micro-cracks and hard-to-see defects can reduce module performance and lifetimes. Micro-cracks can happen anywhere and anytime, during production, transportation or installation.
Two basic models, Spi-EL-HR and Spi-EL-MR can be used for pre- and post-lamination of framed or unframed modules. The system can take the image of the entire module or take individual images of cells and combine them into an overall picture of the module. Combining the individual cells into an overall module picture will provide higher resolution. Image acquisition capture time can be less than 35 seconds for high resolution and 10 seconds for medium resolution.
Systems can be stand-alone or inline; module loading and unloading can be short-side or long-side, including feed in/out conveyors on the same or opposite side of the system.
Inspection of PV c-Si modules
The Spi-EL series of solar module testers use electroluminescence (EL) to identify micro-cracks and other invisible defects in modules. The testers utilize cooled near-infrared charge-coupled device camera technology to image each solar cell with resolutions less than 200µm per pixel, the equivalent of a 60 megapixel image for an entire module.