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Thin-film solar cells (TFSCs) still hold unlocked potential for achieving both high efficiency and low manufacturing costs. The formation of integrated interconnects is a useful way of maintaining high efficiency in small-scale solar cells by their connection in series to form a module. Laser scribing is widely used for scribing a-Si- and CdTe-based TFSCs to form interconnects. The optical properties of the ternary copper-indium-gallium (di)selenide (CIGS) compound are well suited to the solar spectrum, with the potential to achieve a high photoelectrical efficiency. However, since it is a thermally sensitive material, new approaches for the laser-scribing process are required, to eliminate any remaining heating effects. For flexible CIGS solar cells on non-transparent substrates (metal foils or polymer), the scribing process faces additional challenges. This is one reason why ultrashort laser pulses yield better results in terms of scribing quality and selectivity. The modelling of laser energy coupling and an extensive characterization of laser scribes allow approaches to be developed for laser scribing of CIGS solar cells on flexible polymer substrates. The measured high efficiency of the resulting high-speed laser-scribed, integrated CIGS mini-modules proved the capability of this approach.
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Thin-film PV modules are one of the most sustainable options for the generation of electricity, with low material consumption and short energy-payback times. Both of these factors are essential for paving the way towards a terawatt PV market. However, the cost-competitive production of PV modules has become extremely difficult, and module producers are facing huge challenges. A rapid technology transfer from research to industry is therefore required in order to introduce innovations for lower production costs and higher conversion efficiencies. At the Competence Centre Thin-Film- and Nanotechnology for Photovoltaics Berlin (PVcomB), founded by the Helmholtz-Zentrum Berlin (HZB) and the Technical University Berlin, two R&D lines for 30×30cm2 modules based on thin-film silicon and copper indium gallium (di)selenide (CIGS) respectively are operated. Robust baseline processes on a high efficiency level, combined with advanced process and device analytics, have been established as a basis for the introduction and development of further innovative technology steps, and their transfer to industry.
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