SunPower to construct largest power plant in the U.S. for Florida Power & Light Company - 10 July 2008
Applied Materials gains first Italian ‘SunFab’ customer - 09 July 2008
Canadian Solar commits to five new contracts totalling 14.9MW - 07 July 2008
Applied Materials breaks ground at Singapore Operations Center - 08 July 2008
Thin-film start-up Sencera invests $36.8 million in 38MW plant - 08 July 2008
REC ASA enters several silane supply deals worth close to $1 billion - 18 July 2008
Analysts eye tighter subsidies in Spain for solar industry - 18 July 2008
Global market leader SMA Solar Technology AG accelerates time-to-market with Across - 18 July 2008
Solar gains in popularity - 18 July 2008
Solar panels to join backup power plant at West Side facility - 18 July 2008
Yingli Green Energy has said it successfully started 180-micron thick
solar wafer production at the beginning of February 2008, compared to
200-micron volume production as previously used. The move is expected
to reduce its polysilicon usage per watt, increasing wafer output per
ingot and contributing to a reduction in cost of goods sold, the
company said.
“We are pleased to announce the reduction in our wafer thickness and
that over 70% of our estimated polysilicon needs for 2008 has been
contracted,” commented Mr. Liansheng Miao, Chairman and Chief Executive
Officer of Yingli Green Energy. “Our continued efforts to improve
operating efficiencies and reduce wafer thickness have demonstrated the
success of our R&D and other strategic initiatives and we believe
these achievements will help us to be more competitive in 2008.”
The
Company currently expects its PV module shipment target for the full
year of 2008 to be in the estimated range of approximately 255MW and
265MW and said that it believes it has now secured more than 70% of its
expected polysilicon needs for 2008, of which the majority is virgin
polysilicon.
