The ultra-thin solar wafer migration

Materials, especially polysilicon and solar wafers continue to be a major cost centre for crystalline silicon-based cells and modules. At SNEC 2012, PV Tech talked with Peter Brenner, Electronics Marketing Manager, Microcircuit Materials for DuPont about how the industry can migrate to ultra-thin wafers and the materials and technology innovations required to reach that goal.

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  • Photovoltaics International 19th Edition

    For manufacturers who had their heads in the bunker during 2012, fighting falling ASPs and eroding margins, the nineteenth edition brings you details of what lies in store for this coming year. Wright Williams & Kelly return in this issue with their popular analysis of payback on technology buys; crucially they analyze n-type wafers, Al2O3 passivation and copper metallization. SERIS shows us how to achieve 18.7% efficiencies using low-cost etching techniques on diffused wafers. We also have two important technology roundups: CIGS from Helmholtz Berlin, and PV module encapsulation techniques from Fraunhofer ISE.

  • Manufacturing The Solar Future: The 2013 Production Annual

    In the ever-changing global solar markets, cost reduction and measures to increase cell efficiencies are the key tools available to PV manufacturers to create new opportunities and drive your business to the next level. Manufacturing the Solar Future 2013 is the third in the Photovoltaics International PV Production Annual series, delivering the next instalment of in-depth technical manufacturing information on PV production processes designed to help you gain the competitive edge.

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