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DuPont Microcircuit materials introduces new Solamet PV159 for photovoltaic solar cells

08 August 2008 | Thin Film: News From Around The Web | Source: emsnow.com
DuPont Microcircuit Materials (MCM), part of DuPont Electronic Technologies, today announced the introduction of DuPont Solamet® PV159 thick-film metallization paste for frontside photovoltaic (PV) solar cell metallization. This new, advanced material has outperformed competitive metallization pastes in a wide range of processes, and in trials by customers around the world. DuPont will feature new Solamet® PV159 thick-film metallization paste as part of its broad and growing portfolio of photovoltaic solutions in hall 3, stand A13 at the 23rd European Photovoltaic Solar Energy Exhibition held at the Feria Valencia in Valencia, Spain, from 1 to 4 September, 2008.

"DuPont Solamet metallization materials, developed by our world class research team, have set the PV industry standard for many years by enabling customers to reduce costs, increase efficiency and enhance the competitiveness of their products," said Peter Brenner, Photovoltaics Business Manager - DuPont Microcircuit Materials. "With the introduction of Solamet® PV159, DuPont has again raised the bar for frontside PV cell metallization, and we¹re continuing to maximize performance improvements at each account."

Customers who have sampled Solamet® PV159 have seen up to 0.5% efficiency improvement on wafers with shallower emitters compared to standard wafers, with substantial improvements also shown on many other wafer/emitter types.

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