DuPont Microcircuit Materials (MCM) and Holst Centre have formed a partnership to focus on advancing the technology of printed electronics, specifically in the areas of printed structures on flexible substrates, which are used in a variety of markets including flexible display, RFID, lighting, biomedical and organic photovoltaics (OPV).
“As one of the leading material suppliers to the printed electronics industry, DuPont MCM is pleased to collaborate with Holst Centre to enhance the potential for significant new material developments and accelerate market growth in multiple printed electronics applications,” said Kerry Adams, European business development manager for DuPont Microcircuit Materials. “We are honored to be part of such an innovative centre of excellence for the advancement of technologies in this exciting area and look forward to collaborative research with other industrial partners.”
DuPont MCM will become part of the “Printed Structures on Flexile Substrates” program and work towards creating favorable printed metallic structures on flexible substrates in terms of conductivity, fine line deposition and low-energy sintering. Different roll-to roll compatible printing techniques will be examined, including: screen, flexography and ink jet. Further, alternative conductor metallurgies will also be investigated in addition to reactive systems for depositing conductive traces.