The FlexTech Alliance has awarded a $324,000 contract to Etched in Time (EITI) to develop a linear plasma etch module using high density downstream processing in conjunction with reactive ion etch (RIE) for etching of dielectric films.
The developed module will be S-type direct, a new-type of plasma source that will provide plasma clean, adhesion promotion, and PECVD benefits.
The six-month contract is based on the current module market lean towards dry-etch in comparison to wet-etch; at the end of the agreement, EITI’s module will be incorporated into the Roll-to-Roll system at Binghamton University’s Center for Advanced Microelectronics Manufacturing (CAMM) facility in Upstate New York.
“There are currently no plasma sources for roll to roll offered with proven precise, reactive ion etch-grade, dry etch processes,” stated Robert Henderson, president of EITI, in Tempe, Ariz. “Our innovative S-shape, RF discharge source, offers a number of manufacturing advantages for printed electronics, such as high density plasma for low power, low cost construction, compact design, scalable to any linear length, and high uniformity.”
The system is designed to be compatible with a range of roll-to-roll tools, offering a variety of companies in the industry the advantages obtainable through this new technology development.
Mark Poliks, director of research and development at Endicott Interconnect Technologies (EI), as well as technical director for the CAMM said, “We are looking forward to having the module installed at our facility, and proceeding with the follow-on work of refining the new process for different materials.”