Global Semiconductor Alliance (GSA), added Neil Kim, Senior Vice President of Operations and Central Engineering at Broadcom Corporation to its board of directors. Mr. Kim joined Broadcom as director of engineering in January 2000 and became vice president of central engineering in October 2001.
Prior to joining Broadcom, Mr. Kim held a series of technical and management positions at Western Digital Corporation. He received a BSEE from the University of California, Berkeley.As vice president, he manages the company’s relationships with foundries and assembly and test suppliers while overseeing global manufacturing activities, such as foundry operation and packaging and test engineering. Additionally, he is responsible for engineering activities that include the development of analogue mixed-signal and radio frequency (RF) products and building Broadcom’s library of core technologies.
“I appreciate this appointment by the board and look forward to working with my peers, partners and competitors to bring about a more efficient ecosystem so that we all benefit,” he remarked, “GSA is an exceptional organization in that it identifies challenges and opportunities and achieves maximum value for the industry.”