Product Briefing Outline: Komax AG has introduced its new thin-film bussing system which enables precise dispensing of one and two component glue. The existing ribbon handling technology was further improved to eliminate the chambering of the ribbon, which allows the ribbon to be supplied from bigger spools. A system with middle bus bar is also available. In order to cover and fix the ribbon, a black cover tape can be applied as it is often used for CIGS modules. If no tapes are needed, the glue can be cured directly in an additional cell. An automatic cross contacting is available.
Problem: Thin copper ribbons are used together with conductive glue to contact the first and the last cell of a thin-film module. Those ribbons are delivered on coils or on large spools (with up to 2000m on a single spool). However, the chambering of the ribbons makes it very difficult to contact a single, small cell, especially in the case of thin-film modules where the cells are often longer than one metre. In addition, the viscosity of the silver filled epoxy glue strongly depends on the ambient temperature.
Solution: In order to eliminate the chambering for long thin-film cells, Komax adapted its existing ribbon handling technology from the Xcell stringers. In addition, a technology to apply a cover tape was developed. In order to keep the viscosity of the glue constant and independent from the ambient temperature, Komax has introduced a heating/cooling element in its dispensing head. This allows precise dispensing of the glue, together with a mechanism which keeps the distance between the nozzle and the glass surface constant.
Applications: Thin-film photovoltaic modules (substrates as well as superstrates).
Platform: Komax supplies equipment for the crystalline module production and for thin-film back-end module production. The thin-film bussing system is part of the Komax thin-film pre-lamination line.
Availability: Currently available.