Product Briefing Outline: Nordiko Technical Services ‘7500’ Broad Ion Beam Milling system is designed around a new 50cm plasma source and a new high reliability rotary substrate table that allows in repeatable milling performance with very good within wafer non-uniformity from a very low divergence collimated ion beam. The tool can be used in thin film development through to pilot production of a wide variety of materials.
Problem: Ion-beam milling (etching) has been developed and used in R&D to evaluate the influence of interfaces on solar cells. With nanoscale structures being deposited in advanced cell structures Broad Ion Beam Milling systems offer excellent etch uniformity and control of etch feature geometries which are being obtained. Ion-beam sputter deposition also offers significant advantages in the density, crystallinity, and grain size and thickness control.
Solution: The ion source is the largest from Nordiko’s series of RF excited ion beam generators. By matching the attributes of the large plasma generator to a very robust accelerator the ion source delivers ground braking performance in terms of beam quality. The ion accelerators used in these systems are customized to achieve maximum benefit to the application. All are characterized by a robust structure and class leading beam quality delivering perveance matched beams with optimized emittance to deliver tight low divergent broad beams. The system can also perform self organized pattern formation for nanoscale applications.
Applications: Wide variety of thin film materials, substrate size up to 225 mm square.
Platform: The variable angle rotary substrate table provides effective sample cooling. End point detection using secondary ion mass spectroscopy (SIMS) is optionally available for precision milling applications. Wafer handling and process supervision is controlled by the Nordiko automation system.
Availability: Currently available.