Product Briefing Outline: CoreFlow has launched its Wafer Singulation system ‘SingFlow,’ which has successfully passed a number of tests at customer manufacturing sites and internal demonstrations and is ready to be shipped to customers. SingFlow is claimed to be the first automatic system that successfully deals with the delicate separation of wafers from blocks that eliminates manual labor.
Problem: Solar wafer prices fell by 50% in 2009, highlighting the continued need to reduce wafer manufacturing costs. Although manual labor is used widely in low-cost regions the need to reduce breakage, improve quality and increase throughput are key competitive requirements.
Solution: SingFlow singulation system is based on a unique, stress-free, pure-shear singulation concept. This patent-pending technology delivers the first field-proven fully automated production system, and improves production efficiency, throughput and yield of the manufacturing process. The modular system design supports the output to different configurations of lane-based cleaning systems, supporting 5-6 lanes, or cassette loading for batch cleaning. System throughput with a 2-head singulation configuration is 3,000wph with less than 0.25% breakage rate.
Applications: Crystalline solar wafer singulation process. Wafer thickness > 120 micron, plus or minus 30 micron. Wafer size (rectangular) 156mm, 125mm (optional).
Platform: SingFlow features stress-free wafer singulation with a unique control that ensures minimal contact force on the wafer. Minimal wafer manipulations, the integration of customer-specific carrier (used in the glue-dissolving process) into the SingFlow system, as well as direct loading to clean lane or cassette enables a fully automated singulation process. The singulation process is fully controlled with automatic compensation for wafer thickness variation, automatic detection and sorting of broken wafers and submerged operation in filtered water.
Availability: June 2010 onwards.