Product Briefing Outline
Delivering an alternative to high-temperature solder processes, Henkel has developed Hysol Eccobond CA3556HF, a silver-filled electrically conductive adhesive designed to offer fast cure at low temperature. The material is also designed for high-throughput production processes and applications that dictate high peel strength, such as the assembly of PV modules.
While solder is arguably the most common electrical interconnect material, its high temperature requirements make it impractical for certain applications. Fragile, thin, temperature-sensitive substrates are often subject to damage not only from the requisite soldering temperatures, but also from screen and stencil printing processes themselves.
Initially designed to address the unique requirements of the photovoltaic module assembly market, Hysol Eccobond CA3556HF has been proven for other processes, too. Its flexibility for the photovoltaic sector is well-documented, as it is suitable for both crystalline-silicon and thin-film manufacturing. For c-Si cell production, the adhesive delivers an improved bond between the Ag and SnPbAg-coated tabs and the c-Si cells. Thin-film module manufacturers seeking a low-stress, fast-cure electrical interconnection of cells with ribbons have also incorporated the material into their processes.
PV module assembly for c-Si and thin-film applications.
The Hysol Eccobond CA3556HF includes high peel and shear strength, stress minimization properties to compensate for CTE mismatches, fast cure for high throughput and a no-mix, one-part formula which reduces operator error and speeds processing time.