Product Briefing Outline: SunLink has introduced a new ground mount system to its family of commercial and utility-scale module mounting products. The new technology joins the Company’s flagship roof mount system and the recently released thin film solution for Nanosolar. Designed as a total system to save you procurement, management, and deployment time, the patent-pending ‘Ground Mount Solution’ is available as a ballasted or post-mount solution, making it ideal for a wide variety of installations and situations.
Problem: Utility-scale PV projects require fast installations times to meet fast-track construction schedules. Non-penetrating ground mounted ballasted systems are an alternative to post-mount systems, which are more costly, especially in installation engineering time.
Solution: SunLink’s cost-effective ground mount product is designed for a wide variety of brown or green field installations, the ground mount is available as either non-penetrating ballasted systems that require no digging or trenching, or as post-mount systems. Low profile, comprehensive design employs tilt angle options ranging from 20 to 40 degrees and advanced system engineering. The low-profile solution is optimized to minimize environmental impact. By delivering the system on-site with pre-cut, pre-drilled, and pre-welded components, installation time and cost-per-watt are dramatically reduced. As with all SunLink product lines, the ground mount is engineered to accommodate any crystalline photovoltaic module or provider.
Applications: The ballasted system is ideal for agricultural land, leased land, brownfields, landfills, and even retired airfields that may require system relocation at a later date. There are no footings to dig up if the system or land needs to be reused.
Platform: Low-profile, single-row design reduces ballast required and assembly time.
All components are galvanized steel, aluminum or stainless steel, and all edges are coated. Optional locking system reduces theft.
Availability: Currently available.