SNEC 2016: Heraeus targets paste modification lead times of one week at new facility

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Having opened its first dedicated R&D facility in China a year ago, the APAC TDC is a further expansion of the Product Modification Lab (PML) at the facility, the second largest R&D centre operated by Heraeus Photovoltaics.

Major metallization paste producer Heraeus Photovoltaics new APAC Technology Development Center (APAC TDC) in Shanghai, China is aiming to further reduce lead times for product modifications and deliveries to around only one week.

Having opened its first dedicated R&D facility in China a year ago, the APAC TDC is a further expansion of the Product Modification Lab (PML) at the facility, the second largest R&D centre operated by Heraeus Photovoltaics.

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Dr. Weiming Zhang, Senior Vice President Innovation, Heraeus Photovoltaics said, “We have established this center in China to increase broader collaboration with all potential partners along the PV value chain. The PV business is no longer a marathon, it’s a sprint that demands lightning-fast response.”

Quicker response times have become a key requirement due to the myriad of PERC (Passivated Emitter Rear Cell) variations being developed and ramped into volume production as well as other R&D activities on heterojunction cells. 

Heraeus announced the opening of the new facility during SNEC 2016 being held in Shanghai, China this week. The company also launched new pastes for PERC cells at the show.

8 October 2024
San Francisco Bay Area, USA
PV Tech has been running an annual PV CellTech Conference since 2016. PV CellTech USA, on 8-9 October 2024 is our second PV CellTech conference dedicated to the U.S. manufacturing sector. The event in 2023 was a sell out success and 2024 will once again gather the key stakeholders from PV manufacturing, equipment/materials, policy-making and strategy, capital equipment investment and all interested downstream channels and third-party entities. The goal is simple: to map out PV manufacturing in the U.S. out to 2030 and beyond.

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