Meyer Burger Technology has signed a contract worth over CHF25 million to supply wire-saw and wafer-inspection systems to JA Solar. The equipment will be used in the Chinese solar manufacturer’s wafer production facility in Donghai, China, which is scheduled for completion by the end of 2010.
The wafer-slicing gear will be supplied by the Meyer Berger group, while the inspection tools will come from the Hennecke Systems unit.
JA Solar is ramping capacity at the Donghai wafer plant from 120MW to 300MW.
Meyer Burger recently announced another order of more than CHF30 million ($25.8 million) to supply wire saws to an unnamed Asian customer.