The RENA RS 690-DW was developed to achieve diamond wire sawing with highest wafer quality at the lowest Cost of Ownership (CoO). Depending on process parameters a claimed throughput greater than 15 MW/a can be realised. Features such as optimised wire guide axis distance, high wire speed and reduced cutting time are designed to support improved wafer quality and throughput.
Continued focus on wafer cost reductions are required, which include the adoption of diamond wire sawing, which supports reduced kerf loss as well as the potential for thinner wafers. However, to reach the maximum productivity improvements that include wafer quality and yield, focus is required in the area of overall process control. An important factor in the cost of ownership calculation are the coolant costs, which can be supported by suitable coolant recycling solutions for the diamond wire saw process.
Based on the experience with the RS 690-2 wire saw system. RENA engineered the new RS 690-DW especially for diamond wire applications. The mechanical results are a one position saw with optimised wire guide axis distance, a new wire management system and a special coolant distribution system with a small footprint. The process results are claimed to provide the highest wafer quality, improved TTV values, wire consumption < 1 m/wafer and a throughput greater than 15 MW/a. The machine is capable of cutting 156mm x 156mm wafers with a minimum wire core diameter of 100µm. In collaboration with SH+E GROUP, RENA developed a coolant recycling system that improved the coolant lifetime and reduce process costs.
Multi- and mono-crystalline Si-block sawing.
The complete wire saw with electrical cabinet is placed on a footprint of only 3,701 x 2,000 mm, resulting in a saw platform with one 680mm cutting position, according to the company. User friendly (Intuitive MMI- Man-Machine Interface) operation and maintenance is claimed to reduce downtime.
September 2012 onwards.