Somont, a company within the Meyer Burger Group has developed a new soldering table for the semi-automatic connection of solar cells. The new tabletop system is claimed to allow module manufacturers to save valuable time and costs, enabling effective verification of solar cells, soldering strips, flux, pastes without having to interrupt production for evaluation and testing.
Currently development departments are often faced with the challenge of having to test the solderability of new solar cells for the market directly on the stringer in a company’s production line. This results in the loss of valuable production time for testing purposes.
Somont’s new soldering table allows fast and, above all, cost-effective verification of new developments and products (solar cells, soldering strips, flux, pastes etc.) without having to interrupt production. The potential conflict of interest between development and production departments will be reduced and large amounts of material will be able to be tested without any time pressure. Another important advantage the new soldering table offers is a reduction in ramp-up time within the production environment due to the availability of exact parameter measurements. This further contributes to cost savings for manufacturers. Newly developed technology and/or materials can be tested and subsequently verified on the stringer much more quickly than was previously possible. This results in a significant reduction of time and costs in terms of the equipment and production capacity required for development processes.
Cell soldering for 5” and 6” cells as well as 2 and 3BB with fast changeover times. Minimum cell thickness: 160 μ.
The new soldering table is a self-contained soldering station at which materials can be tested under conditions similar to those of actual production, since the soldering unit is identical to those on Somont stringers. Somont’s new table is suitable for use in any laboratory or development unit and uses Somont’s ‘Soft Touch Soldering’ technology that is claimed to provide excellent peeling forces and high-quality reproduction results. Soldering head temperature range: 300 º C. Heating plate: (no pre- and post heating) ¬ 200 º C.
July 2011 onwards.