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1366 Technologies develops thin wafers with thick border to limit breakage

1366 Technologies has unveiled the first of a series of R&D achievements using its proprietary ‘Direct Wafer’ process to grow a three dimensional wafer or a thin wafer with a thick border, an advancement, deemed impossible with conventional ingot-based production technologies.

1366 Technologies secures major ‘Direct Wafer’ supply deal

US-Based ‘Direct Wafer’ producer, 1366 Technologies has secured a major supply deal with Hanwha Q CELLS, a ‘Silicon Module Super League’ (SMSL) member that will enable the company to ramp its planned initial 250MW facility in Genesee County, New York state in 2017.