US-Based wafer producer 1366 Technologies said that a small 500kW PV power plant in Hyōgo, Japan is the first commercial usage of its ‘Direct Wafer’ technology outside several test sites in the US, Germany and Japan.
US-Based wafer producer 1366 Technologies and ‘Silicon Module Super League’ (SMSL) member Hanwha Q CELLS have jointly achieved cell conversion efficiencies of 19.9%, up from 19.6% announced in December, 2016.
1366 Technologies has unveiled the first of a series of R&D achievements using its proprietary ‘Direct Wafer’ process to grow a three dimensional wafer or a thin wafer with a thick border, an advancement, deemed impossible with conventional ingot-based production technologies.
US-Based ‘Direct Wafer’ producer, 1366 Technologies has secured US$10 million in funding from private equity firm, Hanwha Investment Corporation to support the building of its first major production facility at the at high-tech Science and Technology Advanced Manufacturing Park (STAMP) in Genesee County, New York.
US-Based ‘Direct Wafer’ producer, 1366 Technologies has secured a major supply deal with Hanwha Q CELLS, a ‘Silicon Module Super League’ (SMSL) member that will enable the company to ramp its planned initial 250MW facility in Genesee County, New York state in 2017.
Silicon Module Super League member Hanwha Q CELLS has confirmed that its strategic partnership to collaborate on the development of 1366 Technologies proprietary ‘Direct Wafer’ technology has resulted in its R&D pilot line achieving 19.1% cell efficiencies.