China-based PV module package material manufacturer, HIUV Electronic Company, has struck a supply and technology development deal with Yingli Green Energy. Financial details were not disclosed.
Central to the supply deal is Yingli Green’s use of HIUV Electronic’s recently developed PID (potential induced degradation) EVA-based module encapsulants.
The companies said that they would also be collaborating on a range of new products, including encapsulant requirements for N-type monocrystalline-based modules.
Development work will also include encapsulant requirements for thinner module substrate glass and for frameless modules.
HIUV Electronic had recently developed a new PID resistant EVA encapsulant that had undergone successful PID testing, which included a PID test at 85℃ temperature with 85% humidity and continuous -1000V for 96 hours that resulted in less than 5% module performance loss. In another test (60℃ 85% -1000V 96hrs), module performance loss was negligible.
Recently, Yingli Green and DuPont extended a new supply and technology agreement worth US$100 million, which included DuPont’s ‘Solamet’ range of metallisation pastes for solar cells and ‘Tedlar’ polyvinyl fluoride film for module encapsulation requirements.