Maxwell has taken part in the recently concluded SNEC 2025, showcasing its comprehensive solar cell manufacturing solutions, including:
- A Perovskite/HJT Tandem solar cell manufacturing solution
- An HJT solar cell manufacturing solution and
- An HJT direct copper plating technology solution
Perovskite/HJT Tandem solar cell manufacturing solution — pioneering a new era of high-efficiency energy
HJT and perovskite solar cells exhibit exceptional compatibility, with their structurally complementary designs synergistically enhancing efficiency. Perovskite/crystalline silicon tandem solar cells achieve a theoretical efficiency limit of up to 43%, promising vast application prospects.
Maxwell embarked on the R&D of perovskite/HJT tandem solar cells in 2019 and advanced to mass production equipment development in 2023. By 2024, its laboratory achieved critical milestones in perovskite processing equipment, including prototype machines for large-area inkjet printers, evaporation equipment and atomic layer deposition (ALD) equipment, accelerating the progress of the cells toward 100 MW-level pilot production.
From 2024 to early 2025, the company’s fully-textured perovskite/silicon tandem cell obtained certification of 31.50% efficiency from Fraunhofer ISE and of 34.02% efficiency from China’s National Photovoltaic Industry Metrology and Testing Centre (NPVM).
Leveraging its extensive expertise in HJT and tandem technologies, Maxwell has developed a fully integrated production line solution for perovskite/HJT tandem cells. This breakthrough enables:
- 200MW annual production capacity per line
- 29% cell conversion efficiency (with anti-reflective coating)
- 100% proprietary equipment-all core and automated systems independently developed
HJT direct copper plating technology solution — accelerating breakthroughs in cost reduction and efficiency enhancement
Compared to screen printing, Maxwell’s direct copper plating technology solution for HJT cells reduces metallization costs by over 30% with its core technology of N-side seedless copper plating, while boosting cell conversion efficiency by over 0.3%. When combined with low-silver pastes, cost advantages are further amplified.
This integrated solution covers patterning and metallization processes, featuring Maxwell-developed core equipment with high throughput, exceptional processing stability and superior production yield making it suitable for mass production.
