
Trinasolar has announced that its TOPCon-compatible hybrid back-contact (THBC) solar cell has achieved a conversion efficiency of 28.00%, verified by Germany’s Institute for Solar Energy Research Hamelin (ISFH).
This achievement marks the first time a large-format 210R crystalline silicon cell has surpassed the 28% efficiency threshold, setting a new benchmark for mass-producible monocrystalline silicon technologies. It also marks the 39th time Trinasolar has set or broken a world record in solar cell efficiency, further consolidating its industry leadership.
Different from TBC, the newly launched THBC cell integrates TOPCon passivated contacts, heterojunction (HJT)-type surface passivation and a back-contact electrode design, a hybrid high- and low-temperature passivation approach further enhancing passivation performance while maintaining compatibility. In this way, THBC-based modules are intended to not only increase efficiency, but to also enhance appearance and deliver additional customer value in premium distributed-generation applications.
Designed for mass production, the THBC cell is not only compatible with 110–130 μm thin wafers, but also with current mainstream TOPCon production lines, offering a cost-effective upgrade pathway. Based on its existing THBC pilot line, Trina is advancing the industrialization of THBC modules, with its THBC-based products due to be launched soon.
The breakthrough is further underpinned by the company’s long-term R&D investment in both TOPCon and back-contact (BC) technologies. With more than a decade of expertise in BC architectures since 2014, it has continuously advanced cell efficiency limits through iterative innovation across multiple technology generations.
Trina chairman Gao Jifan commented: “In the next phase of crystalline silicon, Trinasolar will drive innovation and lead the industry development through scenario-driven solutions enabled by TOPCon and THBC. With the mission of ‘Solar energy for all’, we will continue to unlock the potential of TOPCon for bifacial applications while accelerating the industrialization of THBC for high-value distributed scenarios, delivering higher efficiency and greater value to customers worldwide.”