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Carbon footprint of PECVD chamber cleaning

November 1, 2008
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By Martin Schottler, Environmental Engineer, M+W Zander GmbH; Mariska de Wild-Scholten, Member of the Research Staff, ECN Solar Energy

The use of perfluorinated gases such as NF3, CF4 or SF6 for PECVD (plasma enhanced chemical vapor deposition) chamber cleaning has a much higher impact on global warming than does the use of onsite-generated F2. This holds true even when supposing that in the future much more effort is paid for the correct abatement and a leak-free supply and take-back chain. This paper will discuss the steps available to the PV industry for control and reduction of carbon emissions in the chamber cleaning process.

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The second edition of Photovoltaics International was published in November 2008. It includes the cost benefits of conversion of used 200mm semiconductor fabs for the PV industry by CH2M Hill in Fab & Facilities, in-line plasma-chemical etching from Fraunhofer IWS in Cell Processing and NREL presents design criteria for back- and front-sheet materials in PV Modules.

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