REC is collaborating with Silicon Genesis Corporation (SiGen) on its thin-PV substrates made using its ‘kerf-free’ wafering process. REC is also collaborating with SiGen to develop high-volume manufacturing equipment and develop silicon ingot shaping requirements. The SiGen technology doesn’t require wafer sawing with wafers produced being within 150um to 50um in thickness and less brittle than conventional solar wafer.
“We are excited to work together with SiGen in order to develop and industrialize this new technology,” commented Erik Sauar, Senior Vice President Technology and CTO of REC. “Provided we can reach sufficient scalability and productivity in the new manufacturing equipment and that all the remaining developments are equally successful as the first phase, this should enable us to manufacture next-generation PV wafers and cells with high efficiency at an even lower cost than with today’s sawing processes.”
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