Hanwha Q CELLS shuts wafering operations

‘Silicon Module Super League’ (SMSL) member Hanwha Q CELLS said it had discontinued its ingot and wafer manufacturing operations in the fourth quarter of 2017, due to the wafer operations being unprofitable.

GCL-Poly expanded wafer production by 62% in 2017

Leading polysilicon and solar wafer producer GCL-Poly Energy Holdings has reported a significant increase in nameplate wafer capacity in 2017, going from 18.5GW in 2016 to 30GW at the end of 2017, a 62.2% rise.

PV capex to exceed US$10 billion in 2018, with 25% growth forecast

PV capital expenditure (capex) in 2018, covering investments into ingot, wafer, cell and module capacity, will grow by almost 25% compared to 2017, passing through the US$10 billion mark, returning to levels last seen back in 2010 and 2011 when investments in turn-key thin-film fabs were a key contributor.

DKEM has developed ‘DK92’ metallization paste to solve different passivation technology challenges

DK Electronic Materials Inc. (DKEM) has launched a new generation of front-side metallization paste. ‘DK92’ series front-side metallization pastes have been developed to be compatible with different passivation technologies and processes for PERC solar cells, including ALD (spatial ALD, and time-based dual-side passivated ALD), PECVD (remote plasma and direct plasma) as well as other non-AlOx passivation solutions to boost the diversified PERC technologies and to further lower the LCOE.