The past few weeks has seen some of the most dramatic knee-jerk, naïve and misinformed PV market reporting seen in recent times, with the headlines often resembling nothing more than tabloid sensationalism.
China-based polysilicon producer Daqo New Energy produced mixed first quarter 2018 results as polysilicon production and shipments hit a new quarterly high, while multicrystalline wafer sales and shipments declined significantly.
Leading PV manufacturing equipment supplier Meyer Burger said it would appeal an initial judgment made in a Chinese court that dismissed its patent infringement lawsuit against Wuxi Shangji Automation Co over its Diamond Wire Management System (DWMS).
‘Silicon Module Super League’ (SMSL) member Hanwha Q CELLS said it had discontinued its ingot and wafer manufacturing operations in the fourth quarter of 2017, due to the wafer operations being unprofitable.
Softbank Vision Fund (SBVF) and GCL Group holding company have signed a memorandum of understanding (MoU) to launch a US$930 million joint venture in the Indian state of Andhra Pradesh, primarily to manufacture PV ingots, wafers, solar cells and modules.
Leading polysilicon and solar wafer producer GCL-Poly Energy Holdings has reported a significant increase in nameplate wafer capacity in 2017, going from 18.5GW in 2016 to 30GW at the end of 2017, a 62.2% rise.
PV capital expenditure (capex) in 2018, covering investments into ingot, wafer, cell and module capacity, will grow by almost 25% compared to 2017, passing through the US$10 billion mark, returning to levels last seen back in 2010 and 2011 when investments in turn-key thin-film fabs were a key contributor.
The majority of Taiwanese solar industry companies that are public listed on the TSE have recently reported December, 2017 sales figures, highlighting how elusive the recovery in sales has been in 2017.
‘Silicon Module Super League’ (SMSL) member Canadian Solar could become a partner with small-scale PV manufacturer in France, Photowatt, a subsidiary of EDF Energies Nouvelles in establishing a manufacturing plant producing next-generation silicon ingots and wafers.
DK Electronic Materials Inc. (DKEM) has launched a new generation of front-side metallization paste. ‘DK92’ series front-side metallization pastes have been developed to be compatible with different passivation technologies and processes for PERC solar cells, including ALD (spatial ALD, and time-based dual-side passivated ALD), PECVD (remote plasma and direct plasma) as well as other non-AlOx passivation solutions to boost the diversified PERC technologies and to further lower the LCOE.