DK Electronic Materials Inc. (DKEM) has launched a new generation of front-side metallization paste. ‘DK92’ series front-side metallization pastes have been developed to be compatible with different passivation technologies and processes for PERC solar cells, including ALD (spatial ALD, and time-based dual-side passivated ALD), PECVD (remote plasma and direct plasma) as well as other non-AlOx passivation solutions to boost the diversified PERC technologies and to further lower the LCOE.
Today, silicon solar cells are still produced in almost equal shares from mono- and multi-crystalline silicon wafers. The authors here look at the scope for efficiencies in the wire sawing process for multi-crystalline silicon.
Major metallization paste producer Heraeus Photovoltaics said it had signed a major strategic partnership agreement with ‘Silicon Module Super League’ (SMSL) leader JinkoSolar that will focus on what the company said would be the development of a new generation of “Super PV Cells” with higher efficiencies and lower costs.
Leading polysilicon and solar wafer producer GCL-Poly Energy Holdings reported lower revenue and profits than expected in the first half of 2017, primarily due to wafer price erosion, only partially offset by higher wafer production volumes and stable polysilicon prices.
Canadian Solar has launched an innovative ‘cool’ PV module design, dubbed ‘Ku’ modules. The new PV module series is based on Low Internal Current (LIC) module technology to provide better module energy yield and reliability.
Specialist solar PV equipment supplier centrotherm has warned that it is unlikely to be profitable in 2017, due to the loss of an arbitration case against a cancelled €290 million integrated (wafer/cell/module) plant in Algeria.
Leading PV manufacturing equipment supplier Meyer Burger has secured a CHF 12 million (US$12.4 million) contract to supply integrated PV module manufacturer, REC Group with its DW 288 Series 3 diamond wire cutting platform.
US-Based wafer producer 1366 Technologies said that a small 500kW PV power plant in Hyōgo, Japan is the first commercial usage of its ‘Direct Wafer’ technology outside several test sites in the US, Germany and Japan.