Hanwha Q CELLS shuts wafering operations

‘Silicon Module Super League’ (SMSL) member Hanwha Q CELLS said it had discontinued its ingot and wafer manufacturing operations in the fourth quarter of 2017, due to the wafer operations being unprofitable.

GCL-Poly expanded wafer production by 62% in 2017

Leading polysilicon and solar wafer producer GCL-Poly Energy Holdings has reported a significant increase in nameplate wafer capacity in 2017, going from 18.5GW in 2016 to 30GW at the end of 2017, a 62.2% rise.

PV capex to exceed US$10 billion in 2018, with 25% growth forecast

PV capital expenditure (capex) in 2018, covering investments into ingot, wafer, cell and module capacity, will grow by almost 25% compared to 2017, passing through the US$10 billion mark, returning to levels last seen back in 2010 and 2011 when investments in turn-key thin-film fabs were a key contributor.

DKEM has developed ‘DK92’ metallization paste to solve different passivation technology challenges

DK Electronic Materials Inc. (DKEM) has launched a new generation of front-side metallization paste. ‘DK92’ series front-side metallization pastes have been developed to be compatible with different passivation technologies and processes for PERC solar cells, including ALD (spatial ALD, and time-based dual-side passivated ALD), PECVD (remote plasma and direct plasma) as well as other non-AlOx passivation solutions to boost the diversified PERC technologies and to further lower the LCOE.

JinkoSolar working with Heraeus on next-gen solar cell R&D activities

Major metallization paste producer Heraeus Photovoltaics said it had signed a major strategic partnership agreement with ‘Silicon Module Super League’ (SMSL) leader JinkoSolar that will focus on what the company said would be the development of a new generation of “Super PV Cells” with higher efficiencies and lower costs.

GCL-Poly in 1H 2017 revenue and profit slump on wafer price erosion

Leading polysilicon and solar wafer producer GCL-Poly Energy Holdings reported lower revenue and profits than expected in the first half of 2017, primarily due to wafer price erosion, only partially offset by higher wafer production volumes and stable polysilicon prices.