Requires Subscription: Photovoltaics International Archive

Technology requirements for Ni/Cu plating metallization in commercial PV


Yuan-Chih Chang, Sisi Wang, Rong Deng, Xiaoli Li, Beibei Zhu, Shaoyuan Li & Jingjia Ji

School of Photovoltaic and Renewable Engineering, University of New South Wales, Sydney, Australia; Shenzhen Institute of Advanced Technology, Chinese Academy of Sciences, China; School of Materials Science and Engineering, Southeast University, China; Faculty of Metallurgical and Energy Engineering, Kunming University of Science and Technology, China

This paper reviews those associated fabrication technologies for the mass production of Ni/Cu-plated contacts. The technologies currently in use in the PV industry for plated contacts, as well as the developing technologies having high scaling-up potential, will be reviewed. In addition, the future requirements for plating metallization will be discussed.


Published In

Photovoltaics International Archive
TOPCon’s technology roadmap
LONGi discusses the route to TOPCon cell efficiency of 25.5%

Read Next

Subscribe to Newsletter

Most Read

Upcoming Events