Engineered Conductive Materials (ECM) has introduced a fast curing conductive adhesive, DB-1590 for use as a solder replacement in next-generation crystalline silicon solar modules using thinned silicon and/or plated bus bars. This material formulation has been optimized to provide improved conductivity and stability on various substrates when cured at 200°C.
Problem
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Thinner wafers are more susceptible to high-temperature processes that could possible cause excess bending, warping or cracking. Faster curing times and low temperatures could also improve process throughput and lower production costs as well as support the migration to thinner, sub-180 micron wafers.
Solution
DB-1590 is designed to gel in five seconds or less at 200°C, developing sufficient strength to withstand the applied stresses induced by the manufacturing process until the adhesive cure is completed during the encapsulant lamination process. DB-1590 has optimized rheology for dispensing, improved damp heat resistance and conductivity stability on tin, tin-silver and silver-plated ribbons. DB-1590 also is stable on OSP treated copper and nickel bus bars.
Applications
The DB-1590 features a rubber-like flexibility that is designed for flexible photovoltaic applications.
Platform
DB-1590 is the latest addition to Engineered Conductive Materials’ full line of conductive stringer attach adhesives, conductive adhesives for back contact crystalline silicon, thin-film and via fill applications, as well as conductive grid inks for photovoltaic applications.
Availability
April 2012 onwards.
