‘Solar Module Super League’ (SMSL) member Trina Solar expects its recently introduced high-performance ‘Duomax V’ bifacial double-glass panel and ‘Tallmax V’ (backsheet) series panel nameplate capacity to reach around 5.5GW by the end of 2020.
‘Solar Module Super League’ (SMSL) member JA Solar surpassed 10GW of PV module shipments in 2019 for the first time, while targeting further growth of 16GW of shipments in 2020.
‘Solar Module Super League’ (SMSL) member, GCL System Integration Technology (GCL-SI) is to build a 60GW solar module megacomplex in Hefei City, China at a cost of approximately US$2.5 billion over a four-year period.
‘Solar Module Super League’ (SMSL) member discloses that its manufacturing operations in Jiangsu, China had suffered an outbreak of COVID-19 that had necessitated a temporary partial shutdown.
‘Solar Module Super League (SMSL) member, Canadian Solar plans to increase module assembly capacity by 3GW in 2020, giving the company a total nameplate capacity of 16GW, while shipments were guided between a range of 10GW to 12GW for the year.
Italian utility Enel has been forced to close the solar manufacturing operations of subsidiary 3SUN after Italian government directives on 22 March 2020 ordered closure of all non-essential production facilities nationwide.
Major semiconductor and specialist solar equipment manufacturer withdraws its business outlook for its FYQ2 as pandemic hits supply chain and manufacturing operations.
Leading monocrystalline wafer producer and ‘Solar Module Super League’ (SMSL) member approves around US$985 million in capex on three separate capacity expansion projects totaling 25GW for 2020.
Major polysilicon and merchant solar cell producer, Tongwei Group is adding 40,000MT of high-purity polysilicon at a cost of around RMB 4 billion (US$563 million), which is to result in its total polysilicon capacity reaching 155,000MT in 2021.
‘Solar Module Super League’ (SMSL) member LONGi Solar has started volume production at its latest 5GW highly automated module assembly plant to produce its HI-MO 1 modules using large area 166mm x 166mm (M6) wafers.