Since Q3 2021, most specialized wafer manufacturers have been mainly focusing on production of large-size wafers, while downstream cell and module manufacturers have been moving forward with the upgrade of their production lines to accommodate the market trend towards large-size, ultra-high-power modules. While the large-size wafer is in line with current market developments, it also presents a greater challenge for existing equipment, especially thermal process equipment, in maintaining the capacity and uniformity of diffusion and coating despite the increase in size - one of the technical difficulties that equipment manufacturers need to overcome.