New high-efficient grinding machine for silicon ingots from Arnold offers shorter cycle-times

November 16, 2011
Facebook
Twitter
LinkedIn
Reddit
Email

For extremely high product quality and productivity for treatment of silicon bricks, Arnold Group has introduced the type 72/865 machine, which is a high-end combination of a surface and chamfering machine. Arnold claims that it now has a balanced production range in the grinding field with this high-end grinding machine which can serve the most different requests of customers. The improvements and further developments of this high-end grinding machine, 72/865, are also integrated in the surface grinding machine 72/860 and chamfering machine 72/852. Furthermore they influence the combination machine, now available as 72/855.

Problem

This article requires Premium SubscriptionBasic (FREE) Subscription

Try Premium for just $1

  • Full premium access for the first month at only $1
  • Converts to an annual rate after 30 days unless cancelled
  • Cancel anytime during the trial period

Premium Benefits

  • Expert industry analysis and interviews
  • Digital access to PV Tech Power journal
  • Exclusive event discounts

Or get the full Premium subscription right away

Or continue reading this article for free

Optimal yield for ingots and wafers is a key metric for cost reduction strategies. Reduction in material loss and material usage such as water consumption is required.

Solution

The new high-efficient grinding machine with four parallely mounted grinding aggregates is suitable for grinding of lateral surfaces and for chamfering of squared silicon workpieces in the formats of 125 x 125 millimeters and 156 x 156 millimeters with an automatic format change. The extremely sturdy machine construction guarantees an excellent machine angularity and an extremely high absorption. The machine processing parts are casted with mineral composite. A new development, the cooling water guidance with a pressure of up to 25 bar, is claimed to guarantee a balanced process cooling and hence reduces the water consumption by nearly one third. This high-end grinding machine is claimed to pave the way to ‘Zero Error’ strategies demanded by the wafer manufacturers. A process capability of >1,67 Cpk at a tolerance of +/-0,05 millimeters on a permanent basis is claimed.

Applications

Silicon ingot grinding requirements.

Platform: Current production and process data are stored, visualized and analyzed with the Arnold remote process analysis tool Arpat and are the basis for the continuous optimization of production and process parameters. The software tool Arpat, developed by Arnold, is a data base and controllable via Web-Browser and is an available option for all Arnold machines.

Availability

September 2011 onwards.
 

Read Next

November 6, 2025
The French and Italian solar markets have both moved forward in their latest public tender process for solar capacity.
November 6, 2025
Inverter manufacturer SolarEdge sold close to 1.5GW of inverters in the third quarter of the year, driving revenue of US$340.2 million.
Premium
November 6, 2025
Third-quarter results show a clear split in the fortunes of China’s leading polysilicon and module producers, writes Carrie Xiao.
November 6, 2025
The low volatility displayed in PV module prices in Europe has reached a sustained equilibrium between production and demand in October, according to online solar marketplace sun.store.
November 6, 2025
Osaka Gas and Sonnedix have announced plans to install a BESS at the latter's 38.7MW Oita solar project in Japan.
November 6, 2025
Pacific Energy has completed the installation of all 66,000 solar modules for a 35MW solar PV plant at a Western Australian mining site.

Subscribe to Newsletter

Upcoming Events

Upcoming Webinars
November 12, 2025
10am PST / 1pm EST
Solar Media Events
November 25, 2025
Warsaw, Poland
Solar Media Events
December 2, 2025
Málaga, Spain
Solar Media Events
February 3, 2026
London, UK
Solar Media Events
March 10, 2026
Frankfurt, Germany