During next week’s Intersolar North America, July 10-12 in San Francisco, Rehm Thermal Systems will have its latest vacuum soldering technology on hand, including its VS 160S vacuum soldering system.
The VS 160S system is said to feature void free vacuum soldering at temperatures up to 450°C with the use of controlled gasses. Rehm notes that its technology sports oxidation and void free interconnections between chip and substrate in packing applications.
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Rehm Thermal Systems can be found at booth 5757.
