SNEC 2011: DuPont’s ‘Solamet PV36x’ metallization pastes offer 0.8% boost to BSF-based cells

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DuPont Microcircuit Materials (MCM) has introduced a new series of aluminum photovoltaic metallization pastes for rear-side passivated crystalline silicon solar cell designs. DuPont ‘Solamet PV36x’ photovoltaic metallization pastes outperform conventional aluminum compositions by delivering up to 0.8% greater conversion efficiency for solar cells when used in Local Back Surface Field (BSF) designs. 

Problem

Revolutionary cell designs such as Local BSF need highly specialized metallization pastes designed to deliver efficiency gains and perform well in processing. Current commercial aluminum pastes designed for conventional cells have poor adhesion to passivation layers used with Local BSF designs, typically SiOx and/or SiNx, unless they contain some glass frit, and if the aluminum paste contains glass frit, voids can form at the edge of the aluminum-silicon contact area. 

Solution

DuPont Solamet PV36x photovoltaic metallization pastes overcome this challenge, while enabling up to 0.8% greater efficiency with these types of designs. They are developed to maximize adhesion and minimize voids, with controlled local alloying combined with high lateral conductivity. 

Applications

Aluminum photovoltaic metallization pastes for rear-side passivated crystalline silicon solar cell designs.

Platform

Two new products are being introduced as part of the series. DuPont Solamet PV361 is designed for laser-fired local contact formation. DuPont Solamet PV362 is optimized for Local BSF contact formation under conventional firing conditions. Both products are compatible with the latest Solamet tabbing silver pastes and new DuPont Solamet PV701 photovoltaic metallization for Metal Wrap Through designs.

Availability

Currently available.
 

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