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Advances in module interconnection technologies for crystalline silicon solar cells

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By Jan Kroon; Dr. Bonna Newman; Jonathan Govaerts; Dr. Eszter Voroshazi; Tom Borgers

In the evolution towards higher cell efficiencies, new cell concepts (twosided and back contacted) have been introduced and for each of these concepts, new module materials and interconnection technologies have to be developed to fulfil all the demands of a good end product in terms of lowest costs, highest yield and power and above all superior quality (reliability and durability). There is no single module concept that fits all cell concepts or module application type so existing module concepts need to be adapted or innovative module technologies are required to fit the aforementioned requirements. This paper provides an overview summarizing the recent developments of integrated cell to module manufacturing approaches such as multi-busbar, multi-wire, half-cell and shingling technologies for two-side contacted cells and advanced soldering, woven fabric and foil based module technologies for back contacted cells aiming for the highest power outputs, lowest costs and longest lifetimes.

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Welcome to Photovoltaics International 41. An emerging theme in the industry further downstream is the growing variety of bankable PV modules. It’s a topic we’ll be picking up on 23-24 October at our PV ModuleTech conference in Penang, Malaysia. This issue of PVI captures the ongoing work to drive improvements across the full range of those technologies. From the exploration of next generation CIGs cells to the commercial improvements of PERC by Trina Solar, this edition neatly captures that variety. Fraunhofer ISE reviews the latest results from efforts to improve the texturing of diamond wire sawn wafers. Trina Solar presents a roadmap for PERC improvements that it claims could halve costs while pushing efficiencies to 24% in around seven years. ECN and imec explore the latest developments in integrated cell to module manufacturing approaches from the more familiar multi-busbar and multi-wire to shingling and woven fabric and foil-based module technologies for back contacted cells. Elsewhere, CSEM INES zooms in on a major limiting factor for silicon heterojunction cells, metallization. All the regular features including our news reviews and R&D spending report make a return, plus lots more. Following on from this bumper edition, PVI42 will be published in Spring 2019.

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