Electrically conductive adhesives (ECAs) are an alternative interconnection technology especially suited to high-efficiency cell concepts with new contact structures. This paper describes the basic principles of this emerging interconnection technology and discusses the different material types on the market. Mechanical and electrical characterization methods for conductive adhesives are also presented. Results are included from peel tests, volume and contact resistivity measurements, metallographic investigations, dynamic mechanical analysis and differential scanning calorimetry. Finally, a novel simulation approach for the cure kinetics of ECAs and arbitrary temperature profiles is briefly described and demonstrated by an example of an epoxy adhesive cure.