Low-temperature interconnection processes for high-efficiency PV cells will be a key R&D topic in the coming years. In reality, to avoid significant deterioration of the surface passivation, the metallization and interconnection processes of silicon heterojunction (SHJ) cells are limited to temperatures below 200°C; tandem cells with a perovskite subcell demand an even greater reduction in process temperature, namely below 130°C. Moreover, to ensure the sustainability of PV production on a TW scale, the use of scarce materials, especially silver, needs to be reduced, as 10% of the world’s supply was already dedicated to PV in 2020. This paper addresses the results obtained in terms of reducing the silver consumption in interconnection technology based on electrical conductive adhesive (ECA) and Pb-free ribbons.
