Mechanical strength of HJT cells: Raising the bar in achieving a low wafer thickness in production


By Alexey Abramov, Dmitry Andronikov, Ilya Nyapshaev, Konstantin Emtsev, Dmitriy Orekhov and Eugeny Terukov of R&D Center of Thin Film Technologies in Energetics (TFTE), St. Petersburg, Russia

Aleksey Ivanov, Viktor Tarasov, Dmitry Saykin, Aleksandr Dubrovskiy, Petr Ishmuratov and Igor Shakhray of Hevel LLC, Novocheboksarsk, Russia

In this paper, an even greater reduction in wafer thickness, down to 130μm, is evaluated, and the critical steps in terms of breakage rates in cell and module production processes are reviewed. Finally, the mechanical stability and reliability of these thin HJT cells in glass–backsheet and glass–glass module types are addressed.

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