Engineered Conductive Materials offers low-temperature curing conductive adhesive for OPV

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Engineered Conductive Materials is offering the ‘DB-1569-1’ low temperature curing conductive adhesive for use in organic photovoltaics (OPV). This material formulation has been optimised for improved conductivity and stability on various substrates when cured at 80°C or higher.

Problem

OPV laminates require low temperature processing to prevent damage. Conductive adhesives that provide correct stability for life-cycle requirements and the often flexible applications OPV is used are essential.

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Solution

DB-1569-1 is more than 90% cured after 30 minutes at 80°C, with a dispensing work life greater than 48 hours (measured as a 25% increase in viscosity), while maintaining optimized rheology for dispensing and excellent damp heat resistance and conductivity stability on tin, tin-silver and silver-plated ribbons. DB-1569-1 features extreme flexibility that is ideal for flexible applications with high peel strength to withstand the stresses induced in flexible BIPV and display applications.

Applications

Low temperature organic photovoltaics (OPV) thin-film laminates.

Platform

This material also can be fast cured at elevated temperatures (1minute @ 180°C).

Availability

January 2013 onwards.

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