Hoku Scientific secures conditional $185 million loan for polysilicon plant

Facebook
Twitter
LinkedIn
Reddit
Email

Hoku Scientific, Inc. has signed a non-binding term sheet with Merrill
Lynch for Hoku Materials, Inc., capital requirements for its
under-construction polysilicon production plant in Pocatello, Idaho.
The loan of $185 million is conditional on Hoku Scientific raising a
further $35 million in cash for use in the construction of the planned
polysilicon plant. The non-binding term sheet will expire on May 31,
2008.

Hoku began construction in May 2007 of its Phase I, 2,500 metric tons
per year, facility, and estimates that total construction costs for
Phase I will be approximately $290 million.

This article requires Premium SubscriptionBasic (FREE) Subscription

Unlock unlimited access for 12 whole months of distinctive global analysis

Photovoltaics International is now included.

  • Regular insight and analysis of the industry’s biggest developments
  • In-depth interviews with the industry’s leading figures
  • Unlimited digital access to the PV Tech Power journal catalogue
  • Unlimited digital access to the Photovoltaics International journal catalogue
  • Access to more than 1,000 technical papers
  • Discounts on Solar Media’s portfolio of events, in-person and virtual

Or continue reading this article for free

Read Next

Subscribe to Newsletter

Upcoming Events

Solar Media Events
February 28, 2024
Seattle, USA
Solar Media Events, Industry Events
March 12, 2024
Frankfurt, Germany
Upcoming Webinars
March 13, 2024
9am EDT / 1pm GMT / 2pm CET
Solar Media Events
March 19, 2024
Texas, USA