Huntsman develops a new encapsulating system for PV Inverters

April 18, 2013
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Huntsman Advanced Materials has launched a new product for potting of solar inverters. The polyurethane system ‘Arathane’ CW 5660 / HY 5610 has been designed to meet the key requirements of inverters for PV applications. Fast processing, high thermal endurance combined with low temperature flexibility and high thermal conductivity are the key features of the new system.

Problem

Fast and efficient processing at ambient temperatures requires an encapsulant with excellent flowability together with a reasonable low mix viscosity. On the other hand the encapsulant should provide a reasonable high thermal conductivity to remove produced heat in a fast and efficient way. Long-term thermal endurance at higher temperatures combined with low temperature flexibility is one of the main challenges for the development.

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Solution

High thermal conductivity is one key element for encapsulants in the design of inverters allowing fast dissipation of produced heat. For that reason the system has been formulated using mineral filler with an acceptable high filler load keeping required low viscosity in mind. The system offers a thermal conductivity of 0.7W/mK together with a mix viscosity of only 1900 mPa s at room temperature. High thermal endurance combined with low modulus of elasticity has been balanced through an appropriate polymer backbone. First storage trials at high temperatures indicate a possible thermal class F material according to IEC 60085.

Applications

Arathane CW 5660 / HY 5610 is an optimally filled casting system for processing and curing at room temperature.

Platform

The system enables fast and efficient casting of large PV inverters. Arathane CW 5660 / HY 5610 is a flexible multipurpose polyurethane system for pressure sensitive devices, encapsulation of Printed Circuit Boards and inductivities. It is expected to UL recognized to UL 94 with a V-0 rating and investigation of RTI according UL 746 is planned. A Thermal Class F can be expected according IEC 60085.

Availability

January 2013 onwards. 

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