ISOVOLTAIC is offering a new encapsulating material which is combined directly with its production proven ICOSOLAR backsheets and completely replaces a layer of encapsulating material in the module.

Problem

Reducing material costs, especially in the area of module assembly are critical. However, concern should be given to overall product reliability factors against lower cost or reduction in material layers, especially in the critical backsheet area.

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Solution

ICOSOLAR encapsulant is manufactured from a new material (TPO – thermoplastic polyolefin) and is claimed to have advantages over various materials used previously. A layer of encapsulant material between the cell and the backsheet is replaced completely, simplifying the manufacturing process of photovoltaic modules. Combined with the established ICOSOLAR backsheets, the encapsulating layer is claimed to exhibit excellent adhesion to all common encapsulating materials and does not form any acetic acid in the damp heat test. By comparison with EVA, encapsulant exhibits less water absorption and water vapour permeability as well as improved damp heat and UV stability.

Applications

c-Si PV module encapsulation.

Platform

With ICOSOLAR 4002 (ICOSOLAR AAA3554 with encapsulating material), ICOSOLAR 4006 (ICOSOLAR APA 4004 with encapsulating material) and ICOSOLAR APA 3G plus (ICOSOLAR® APA 3G with encapsulating material), ISOVOLTAIC enables more efficient production of photovoltaic modules. ICOSOLAR backsheets with encapsulant can also be ordered cut-to-size thus creating less waste in downstream processing.