New Product: The InnoLas Impala offers multiple laser beams and parallel processing heads

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Product Briefing Outline: The InnoLas Impala series of large scale laser processing systems provides multiple laser beams technique and parallel processing heads for increased throughput. Innovative handling concepts minimize defects and contamination. The IMPALA laser systems are designed for all high-accuracy processes (P1 through P3) of thin film processing. InnoLas Systems can ensure optimal transition to industrial production conditions.

Problem: Precise laser scribing is of key importance for successful production of thin-film solar modules. The accuracy of the scribing process as well as the use of an appropriate laser source according to the substrate has direct influence on the quality and efficiency of the finished solar panels. At the same time the processing time has to be minimized to guarantee utmost throughput and a most cost-efficient way of manufacturing.

Solution: To optimize results the Impala ‘Multiple Laser Beam Option” enables substrates to be processed with multiple laser beams in parallel. With the integration of different wavelength laser sources, the system can also be customized to specific application requirements. Substrates are manipulated on the machine platform with minimum mechanical contact to avoid damage and contamination. Machine precision minimizes distances between scribes in monolithic interconnections. Impala InnoLas systems now offers the Impala TTG for ‘Through-The-Glass’-structuring. With these two main models, all thin-film applications are covered.

Applications: Impala/Impala TTG are designed as workstations for precise processing over a large area for processing panels up to 1200 x 1600 mm size.

Platform: Modular in construction they can be tailored to customer requirements. Both laser processing and mechanical scribing are available. A variety of laser sources (Nd:YAG-, Nd:Vanadate-, Pico-Second laser at 355 nm /532 nm /1064 nm wave length) is available to machine different thin-film technologies. Enhanced drive and handling concepts, automatic alignment based on precise machine vision systems as well as integrated solutions to compensate for glass waviness, provide the required accuracy and throughput.

Availability: June 2010 onwards.

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