Continuing with its recently announced restructuring, specialist PV equipment supplier, GT Advanced Technologies has detailed some management changes.
The company said that its business unit general manager positions have been eliminated, while Cheryl Diuguid, formerly general manager of the sapphire business unit, has left the company.
The role of chief strategy and new business officer is to be eliminated by the end of January, which will result in David Gray leaving the company. Strategic business efforts will be amalgamated into the CEO, Tom Gutierrez’s responsibilities.
A streamlined management structure will include Dan Squiller taking on the roles of responsibility for sales, service and worldwide operations. Under Squiller, Dave Keck, formerly general manager, polysilicon and photovoltaic equipment, will lead the company's sales and service roles across all businesses.
Although the company had previously said it would exit the DSS furnace business, existing customers will be supported by Jeff Ford, vice president of DSS business development.
Next generation solar activities that include its recently acquired Hyperion ion implant exfoliation technology as well as its sapphire technology will be managed under Vikram Singh, executive vice president, Advanced Systems Development. Dr. Singh will also remain responsible for all central engineering support services as well as business development and product management.
Dr. P.S. Raghavan, chief technology officer, will be continue to lead technology development for silicon carbide (SiC) and gallium nitride (GaN) applications.
GTAT also highlighted that final development and beta build activities for its ‘HiCz’ polysilicon product will be relocated to its Merrimack, New Hampshire facility and will be idling its HiCz materials pilot manufacturing facility in St. Louis, with the loss of approximately 35 jobs.
The company reiterated that it was looking for a strategic partner to purchase the St. Louis operation and support the future roll-out of its HiCz PV furnace technology that will produce N-type silicon wafers.