SNEC 2014: Amtech hopes to build on recent PECVD orders

May 18, 2014
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PV equipment supplier, Amtech Systems is highlighting two new innovations at SNEC 2014 that include its ‘SPECTRE’ PECVD system after several new order wins for passivation and anti-reflective coating processes using the technology.

Dr. Albert Hasper, General Manager of Amtech subsidiary, Tempress Systems said, “We are very pleased that our continued investment in research and development, technologies and equipment during the industry down-cycle are now advancing our offerings into an evolving solar market.  We expect these new innovations will bring our customers new solutions that enable them to reduce costs and increase efficiency. I am particularly proud of the fact that after introducing our new direct plasma SPECTRE PECVD system, we now offer two new innovations that can be integrated in existing and new production lines as the market looks to position itself for next generation production.”

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Amtech is also showcasing a new POCl(3) process on a Tempress Systems' 5-stack platform for emitter resistivity of up to 140 ohm/square. The atmospheric process is claimed to enable low maintenance and high uptime with a throughput of more than 3,200wph, culminating in the lowest cost per wafer currently available, according to the company.

Development of its Kingstone Semiconductor ion implant tool was also said to be progressing, currently yielding a claimed average efficiency in production environments of 20.3%, with greater than 20.8% in the lab. Though cost of ownership issues had dogged ion implant technology adoption, the company claimed the CoO was lower than previous generations of the tool.
 

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