PV equipment supplier, Amtech Systems is highlighting two new innovations at SNEC 2014 that include its ‘SPECTRE’ PECVD system after several new order wins for passivation and anti-reflective coating processes using the technology.
Dr. Albert Hasper, General Manager of Amtech subsidiary, Tempress Systems said, “We are very pleased that our continued investment in research and development, technologies and equipment during the industry down-cycle are now advancing our offerings into an evolving solar market. We expect these new innovations will bring our customers new solutions that enable them to reduce costs and increase efficiency. I am particularly proud of the fact that after introducing our new direct plasma SPECTRE PECVD system, we now offer two new innovations that can be integrated in existing and new production lines as the market looks to position itself for next generation production.”
Unlock unlimited access for 12 whole months of distinctive global analysis
Photovoltaics International is now included.
- Regular insight and analysis of the industry’s biggest developments
- In-depth interviews with the industry’s leading figures
- Unlimited digital access to the PV Tech Power journal catalogue
- Unlimited digital access to the Photovoltaics International journal catalogue
- Access to more than 1,000 technical papers
- Discounts on Solar Media’s portfolio of events, in-person and virtual
Or continue reading this article for free
Amtech is also showcasing a new POCl(3) process on a Tempress Systems' 5-stack platform for emitter resistivity of up to 140 ohm/square. The atmospheric process is claimed to enable low maintenance and high uptime with a throughput of more than 3,200wph, culminating in the lowest cost per wafer currently available, according to the company.
Development of its Kingstone Semiconductor ion implant tool was also said to be progressing, currently yielding a claimed average efficiency in production environments of 20.3%, with greater than 20.8% in the lab. Though cost of ownership issues had dogged ion implant technology adoption, the company claimed the CoO was lower than previous generations of the tool.
