Tokuyama Corporation, a Japanese silicon producer, has teamed up with 1366 Technologies, a solar wafer manufacturer, with a key focus on research and development.
Under the partnership, the two companies will collaborate on research and development with the goal to accelerate the adoption of 1366 Technologies’ Direct Wafer technology.
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Direct Wafer is a transformative manufacturing process, which the company claims produces a uniformly better silicon wafer at half the cost of standard wafers. In January, the firm established a new 25MW manufacturing facility in Bedford, Massachusetts, which represented the final step to the commercialisation of the technology.
“Strong partners are an essential element to our success, and we have found another in Tokuyama. This is a fantastic validation of our technology with tremendous upside,” said Frank van Mierlo, CEO of 1366 Technologies. “When many in the solar industry are pulling back, 1366 and Tokuyama are readying for the inevitable global market turnaround.”