News

March 26, 2018
PV and electronics equipment manufacturing and automation specialist Manz AG has dismissed its CFO, Gunnar Voss von Dahlen with immediate effect.
March 26, 2018
The evolution of metallization paste and its impact on cell technology development was a key topic at PV CellTech 2018. During the conference, we caught up with Guangyao Jin, chief scientist, DuPont Solamet photovoltaic metallization pastes, to discuss industry trends.
March 26, 2018
Indian power minister R.K. Singh has chaired a meeting with battery-based energy storage manufacturers calling on them to set up manufacturing units in India.
March 26, 2018
Renewable energy developer Infinergy Pacific, a subsidiary of UK-based firm Infinergy, has sold the 120MW Metz Solar Farm in New South Wales to unnamed clean energy investors.
March 26, 2018
Indian state-run power firm National Hydroelectric Power Corporation (NHPC) has completed a 50MW solar PV project in the state of Tamil Nadu, according to a Bombay Stock Exchange filing.
March 26, 2018
State-run utility Ethiopian Electric Power (EEP) has announced the list of pre-qualified bidders for the country’s 250MW(AC) Scaling Solar tender.
March 26, 2018
DGAD has also extended the deadline for responses in its anti-dumping investigation into solar glass imports from Malaysia.
March 23, 2018
India-based solar independent power producer Azure Power has secured new project wins with Indian Railways and Karnataka Renewable Energy Development totalling 130MW.
March 23, 2018
Researchers at Solliance and ECN have fabricated a 6 inch industrially processed c-Si cell with a perovskite top layer that is mechanically stacked using ECN’s MWT-SHJ (metal-wrap-through silicon heterojunction) design that has achieved conversion efficiencies of 26.3%. The work was published during the Silicon PV/nPV conference, in Lausanne, Switzerland.
March 23, 2018
Researchers at the Solar Energy Research Institute of Singapore (SERIS) at the National University of Singapore (NUS) have announced the development of a significantly low-cost technique to texture nanoscale features on multicrystalline silicon (mc-Si) wafers after diamond-wire wafer cutting.

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